EDN - Voice of the Engineer
Nov 7, 2024 · Electronic Design News (EDN) is an electronics community for engineers, by engineers. Find the latest articles, magazines, tools, and blogs in the industry.
Fundamentals of I3C interface communication - EDN
Dec 5, 2022 · I3C is a new serial communication protocol for embedded systems that offers significantly higher data throughput and more advanced features than I 2 C. With I3C, engineers and designers can improve the performance of their designs while also adding in new features like hot-join, in-band interrupts (IBI), and high data rate (HDR) modes.
Equalization Techniques: CTLE, DFE, FFE, and Crosstalk - EDN
Oct 21, 2015 · Explore Common Equalization Techniques Including, CTLE (continuous time linear equalization), DFE (decision feedback equalization), FFE (transmitter feed-forward equalization), and Crosstalk.
USB Type-C PD 3.0 Specification, Charging and Design - EDN
Jun 25, 2021 · Introduction. The USB Type-C connector and power delivery (PD) specification has brought radical changes to the mobile device industry, and USB Type-C PD 3.0 could optimize battery charging for portable devices.
Eye Diagram Basics: Reading, Analyzing and Applying
Dec 16, 2011 · How to read an eye diagram. A properly constructed eye should contain every possible bit sequence from simple alternate 1’s and 0’s to isolated 1’s after long runs of 0’s, and all other patterns that may show up weaknesses in the design.
Setup and Hold Time Equations and Formulas - EDN
Aug 10, 2012 · Setup and hold time equations. Let’s first define clock-to-Q delay (T clock-to-Q).In a positive edge triggered flip-flop, input signal is captured on the positive edge of the clock and corresponding output is generated after a small delay called the T clock-to-Q.The flip flop can only do the job correctly if the data at its input does not change for …
A sneak peek at HBM cold war between Samsung and SK hynix
Apr 15, 2024 · As high-bandwidth memory (HBM) moves from HBM3 to its extended version HBM3e, a fierce competition kicks off between Samsung and SK hynix. Micron, the third largest memory maker, has also tagged along to claim stakes in this memory nirvana that is strategically critical in artificial intelligence (AI) designs.
All you need to know about GAA chip manufacturing process
Nov 21, 2022 · Figure 1 The shift from planar to FinFET to GAA transistors marks a relentless technology journey in semiconductor manufacturing. Source: Lam Research The first GAA technology was demonstrated in 1986; building GAA transistors in a lab was much easier than manufacturing GAA-based chips on a scale.
Burn-in 101 - EDN
Oct 14, 2014 · This curve has three stages: Stage 1: Infant Mortality/Early Life – This is the period were early failures show up in a component. These are due to lack of control in manufacturing processes at the molecular level.
Introduction to lithium-ion rechargeable battery design - EDN
Feb 28, 2017 · This article will provide an overview on how to design a lithium-ion battery. It will look into the two major components of the battery: the cells and the electronics, and compare lithium-ion cell chemistry to other types of chemistries in the market, such as sealed lead acid (SLA), nickel-metal hydride (NiMH), and nickel-cadmium (NiCd), and how that affects the design.