ISE Labs, a subsidiary of ASE Technology, has acquired land in Tonalá, Jalisco, to establish a semiconductor packaging and ...

Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with ...

The original design and supply contract, which started production in 2022, initially focused on one flagship vehicle model. Since then, the inclusion of EnSilica’s ASICs has expanded to other vehicle ...

Tessolve, a Hero Electronix venture and a provider of semiconductor engineering solutions, has signed an agreement to acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in ...

Tessolve in India has acquired leading chip design house Dream Chip Technologies in Hannover, Germany in a Rs 400 crore (€44.1m, $47.4m) deal ...

It strengthens Tessolve’s leadership in the industry by adding advanced capabilities in System on Chip (SoC) designs for AI, ...

“Dream Chip’s capabilities further strengthen our ability to take on leading-edge ASIC design projects and greatly enhance ..

This acquisition catapults Tessolve to the global elite in chip/ ASIC designBengaluru — Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting ...

Joins the first wave of new semiconductor transistor architecture developmentTaipei, Taiwan, Nov. 05, 2024 (GLOBE NEWSWIRE) - ...

The processor compute chiplets on the accelerator cards manage up to dozens of antennas simultaneously and will need to grow in compute power as requirements become more complex with the move to 6G.

Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in ...