Joins the first wave of new semiconductor transistor architecture developmentTaipei, Taiwan, Nov. 05, 2024 (GLOBE NEWSWIRE) - ...

Demand for Customization and Performance Optimization SEALSQ ASICs are tailored IC chips designed for specific applications, ...

This acquisition catapults Tessolve to the global elite in chip/ ASIC designBengaluru — Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting ...

Tessolve, a Hero Electronix venture and a provider of semiconductor engineering solutions, has signed an agreement to acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in ...

Tessolve, an India-based semiconductor engineering firm owned by Hero, the world's largest two-wheeler brand, has acquired ...

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announces the launch of its latest SoC platform, HiSpeedKit™-HS, designed to enhance and streamline ...

It strengthens Tessolve’s leadership in the industry by adding advanced capabilities in System on Chip (SoC) designs for AI, ...

Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in ...

“Dream Chip’s capabilities further strengthen our ability to take on leading-edge ASIC design projects and greatly enhance ..

Reliability is something people have been talking about for quite a while, but we’ve seen a change recently with new types of architectures in terms of chip packaging of ICs ... back-end designers, or ...