Chiplets and advanced packaging could shake up the landscape. Typically, to advance a design, the industry develops an ASIC using chip scaling to fit different functions onto a single monolithic die.

Historically, taping out an ASIC has been very expensive ... play with and wind up with somewhere around 100 to 300 chips in chip-scale packaging (CSP). You can see a typical CSP sitting on ...

defines a packaging option in which multiple die and/or packaged devices (SOICs, CSPs) are incorporated into a single package. The MCP may be considered as an alternative to an Application Specific ...

Demand for Customization and Performance Optimization SEALSQ ASICs are tailored IC chips designed for specific applications, setting them apart from general-purpose chips. This approach enables SEALSQ ...

Joins the first wave of new semiconductor transistor architecture developmentTaipei, Taiwan, Nov. 05, 2024 (GLOBE NEWSWIRE) - ...

The original design and supply contract, which started production in 2022, initially focused on one flagship vehicle model.

“Dream Chip’s capabilities further strengthen our ability to take on leading-edge ASIC design projects and greatly enhance ..

Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in ...

These mining giants join forces to release the U3S21EXPH, a next-generation ASIC miner featuring advanced liquid-to-chip cooling technology. Hut 8 Corp. (Nasdaq | TSX: HUT), a leading Bitcoin mining ...

Tessolve, an India-based semiconductor engineering firm owned by Hero, the world's largest two-wheeler brand, has acquired ...

This acquisition catapults Tessolve to the global elite in chip/ ASIC designBengaluru — Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting ...