ECUs that are designed today need to have the performance and flexibility to run the workloads of the next decade.

At Rambus, we often receive RFIs, RFPs and RFQs for security silicon IP cores to be used in our customer’s next semiconductor ...

SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.

The international standard has been proven effective in automotive functional safety and has begun to spread to other markets ...

To tackle these reliability challenges, IC designers are increasingly embracing a “shift-left” mindset, where reliability ...

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, ...

A technical paper titled “Roadmap for Schottky barrier transistors” was published by researchers at University of Surrey, ...

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and ...

The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...

TLP headers in PCIe 6.0; AL/ML in functional verification; generative AI pilot; virtual twins for semi R&D; III-V tech.

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...

Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.