Highlighting Innovation, Sustainable Manufacturing, and OEM/ODM Excellence for Global Luxury Brands CALIFORNIA, CA, ...

Mondragon Assembly has acquired ATP Engineering & Packaging, a company based in Barberà del Vallès, Barcelona, Spain.

Analyst Insight: When packaging engineers are brought in late in the process, a small issue can turn into major operational problems. A recent planter redesign showed how a quarter-inch mismatch ...

By Max A. Cherney SAN JOSE, California, March 2 (Reuters) - ASML Holding has ambitious plans to expand its line of chipmaking ...

Newer technologies such as 3D chips and heterogeneous packaging is pushing the focus towards materials engineering, Prabu Raja, president, of the Semiconductor Products Group at Applied Materials told ...

ASML (ASML) plans to expand its chipmaking equipment portfolio with new products to capture more of the growing market for AI chips.

Packaging Corporation of America CEO Mark Kowlzan detailed the impact of investments over the last decade, where energy projects are set to occur, and his optimism for nearshoring, during a BofA ...

GPGI, Inc. (NYSE: GPGI) today announced the appointment of 30-year company veteran Robert Domodossola as President and Chief ...

Automation transforms packaging operations, but people still configure systems, interpret data, resolve faults, and drive improvement.

Application-Specific Cutting Solutions Driven by Advanced Engineering and Custom Design IRVINE,CALIFORNIA, CA, UNITED ...

ASML stock jumps 30% YTD as the chipmaking equipment leader pushes High-NA EUV technology forward and explores advanced AI chip packaging opportunities.

Zeus Packaging Group has acquired Spanish-headquartered packaging firm Koex Packaging Solutions, in a deal worth €24m (£21m).