Joins the first wave of new semiconductor transistor architecture developmentTaipei, Taiwan, Nov. 05, 2024 (GLOBE NEWSWIRE) - ...

This acquisition catapults Tessolve to the global elite in chip/ ASIC designBengaluru — Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting ...

Tessolve, a Hero Electronix venture and a provider of semiconductor engineering solutions, has signed an agreement to acquire Dream Chip Technologies, a semiconductor chip design firm headquartered in ...

It strengthens Tessolve’s leadership in the industry by adding advanced capabilities in System on Chip (SoC) designs for AI, ...

“Dream Chip’s capabilities further strengthen our ability to take on leading-edge ASIC design projects and greatly enhance ..

Tessolve in India has acquired leading chip design house Dream Chip Technologies in Hannover, Germany in a Rs 400 crore (€44.1m, $47.4m) deal ...

Dream Chip’s capabilities further strengthen our ability to take on leading-edge ASIC design projects and ... Tessolve's strengths in post-silicon testing and packaging, Tessolve now offers ...

Egis Technology (EgisTec), recently transformed into the ASIC business, has signed a strategic cooperation agreement with ...

Taiwan Semiconductor is set to double its production capacity for advanced packaging, a move driven by the increasing demand ...

Co. Ltd. TSM is set to double its production capacity for advanced packaging, a move driven by the increasing demand for artificial intelligence chips from major players like Nvidia Corp. NVDA ...

Japan's component manufacturer Kyocera Corporation is experiencing a downturn in its semiconductor organic packaging ...