SAN DIEGO, 24 Jan. 2011. AEM Inc. has unveiled a high-reliability-qualified tin/lead (Sn/Pb) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM ...
A research team has developed a new thin film deposition process for tin selenide-based materials. This process utilizes the metal-organic chemical vapor deposition (MOCVD) method, enabling thin film ...
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