Stacking ultrathin complex oxide single-crystal layers allows researchers to create new structures with hybrid properties and multiple functions. Now, using a new platform, researchers will be able to ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

IMEC has introduced a ‘via-middle through-Si-via’ approach to 3D stacking. “This method is new to industry as it allows to reveal through-silicon via [TSV] contacts by using a silicon etch process,” ...