Historically, taping out an ASIC has been very expensive ... play with and wind up with somewhere around 100 to 300 chips in chip-scale packaging (CSP). You can see a typical CSP sitting on ...

Chiplets and advanced packaging could shake up the landscape. Typically, to advance a design, the industry develops an ASIC using chip scaling to fit different functions onto a single monolithic die.

Such coordinated solutions for advanced packaging are crucial in the vertically disintegrated world of chiplets. Take the case of Faraday Technology Corp., an ASIC design service and IP provider now ...

The gnarliness of manually installing Linux-based chip design tools disappears with this simple installation of required Open-Source ASIC design ... sprinkling in packaging and mechanical ...

Joins the first wave of new semiconductor transistor architecture developmentTaipei, Taiwan, Nov. 05, 2024 (GLOBE NEWSWIRE) - ...

“Dream Chip’s capabilities further strengthen our ability to take on leading-edge ASIC design projects and greatly enhance ..

The original design and supply contract, which started production in 2022, initially focused on one flagship vehicle model. Since then, the inclusion of EnSilica’s ASICs has expanded to other vehicle ...

Alchip Technologies reports that it has taped out a 2nm test chip and expects the results by the first quarter of next year.

These mining giants join forces to release the U3S21EXPH, a next-generation ASIC miner featuring advanced liquid-to-chip cooling technology. Hut 8 Corp. (Nasdaq | TSX: HUT), a leading Bitcoin mining ...

HSINCHU, Taiwan--(BUSINESS WIRE)--Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and ... that their jointly developed 2.5D packaging platform has successfully entered ...

This acquisition catapults Tessolve to the global elite in chip/ ASIC designBengaluru — Tessolve, a Hero Electronix venture and a leading provider of semiconductor engineering solutions for cutting ...