Integrated circuit packaging - Wikipedia
WEBIntegrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.
The Ultimate Guide to Semiconductor Packaging - AnySilicon
WEBSemiconductor packaging is a crucial aspect of electronics manufacturing that involves enclosing semiconductor chips in protective and functional packages to ensure their reliability, performance and integration into electronic devices.
ASIC Design: From Spec to Chips - AnySilicon
WEBThis post covers the different steps in the ASIC design starting from ASIC design specification to design tape-out for manufacturing in the foundry, packaging and testing and highlight important decisions and activities that each step entails.
Application-specific integrated circuit - Wikipedia
WEBAn application-specific integrated circuit (ASIC / ˈ eɪ s ɪ k /) is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec.
Advanced chip packaging: How manufacturers can play to win
WEBMay 24, 2023 · Advanced-packaging techniques that have arisen over the past two decades—including 2.5-D, 3-D, fan-out, and system-on-a-chip (SoC) packaging—promise to fill the void by supplementing the wire-bonding and flip-chip technologies of …
The Ultimate Guide to ASIC Design: From Concept to Production
WEBApr 14, 2023 · Flip-chip: In flip-chip packaging, the ASIC die is flipped upside-down and connected to the package substrate using solder bumps. This technology offers better electrical performance and a smaller form factor than …
The beginner’s guide to 3D IC - Semiconductor Packaging
WEBJul 7, 2022 · A chiplet is an ASIC designed to integrate with other chiplets within a package. These chiplets come in two classes: 2D (or 2.5D): Integrating two chips on a single interposer and interconnecting those chiplets on that interposer using metal interconnect. 3D: Die stacking involves stacking memory or sensor chips on another chip (like memory ...
American Semiconductor Innovation Coalition (ASIC)
WEBThe American Semiconductor Innovation Coalition (ASIC) represents 200 businesses, startups, universities, national labs, and nonprofits dedicated to bringing the best research and development to The National Semiconductor Technology Center and The National Advanced Packaging Manufacturing Program.
Custom ASICs | Pushing the boundaries of AI with advanced
WEBCustom, cloud-optimized data infrastructure ASIC designs incorporating cutting-edge IP, multi-chip packaging and the industry's most advanced process technologies.
Custom ASIC: The Ultimate Guide - AnySilicon
WEBPackaging: Expenses for protecting the chip and preparing it for integration into the final product. Quality Assurance and Testing : Costs to ensure each chip meets the required specifications and performance standards post-manufacturing.